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XCZU4CG-2FBVB900I

XCZU4CG-2FBVB900I

XCZU4CG-2FBVB900I

Xilinx Inc.

900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.85V

SOT-23

XCZU4CG-2FBVB900I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 204
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,697.80000 $1
XCZU4CG-2FBVB900I Product Details

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.For safe operation, it is advisable to utilize a power supply with 0.85V voltage.In the SoCs wireless, high voltages above 0.876V are considered dangerous and should not be used.In order to run it, it must be fed by at least 0.825V of power.The system on a chip uses 900 terminations in total.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU4CG-2FBVB900I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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