900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.85V
SOT-23
XCZU6CG-2FFVC900I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC CG
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B900
Supply Voltage-Max (Vsup)
0.876V
Supply Voltage-Min (Vsup)
0.825V
Number of I/O
204
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$2,883.12000
$2
XCZU6CG-2FFVC900I Product Details
This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).
On this SoC, there is Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC CG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 204 I/Os.It is recommended to use a 0.85V power supply.In the SoCs wireless, voltages above 0.876V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.825V.In total, there are 900 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT
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