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XCZU6CG-2FFVC900I

XCZU6CG-2FFVC900I

XCZU6CG-2FFVC900I

Xilinx Inc.

900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.85V

SOT-23

XCZU6CG-2FFVC900I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 204
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2,883.12000 $2
XCZU6CG-2FFVC900I Product Details

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC CG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 204 I/Os.It is recommended to use a 0.85V power supply.In the SoCs wireless, voltages above 0.876V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.825V.In total, there are 900 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU6CG-2FFVC900I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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