Welcome to Hotenda.com Online Store!

logo
userjoin
Home

XCZU6EG-3FFVC900E

XCZU6EG-3FFVC900E

XCZU6EG-3FFVC900E

Xilinx Inc.

0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

SOT-23

XCZU6EG-3FFVC900E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 600MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3,800.70000 $3
XCZU6EG-3FFVC900E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU6EG-3FFVC900E System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

Related Part Number

XCZU7CG-2FBVB900I
IB903FC-Q24
IB903FC-Q24
$0 $/piece
XCZU2EG-2SFVC784E
XC7Z045-3FFG900E
XC7Z045-3FFG900E
$0 $/piece
XCZU9EG-2FFVB1156I
XCZU7EV-1FFVC1156E
XCZU9CG-2FFVC900E

Get Subscriber

Enter Your Email Address, Get the Latest News