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XL210-256-FB236-I20

XL210-256-FB236-I20

XL210-256-FB236-I20

XMOS

ROMless XCore 32-Bit 10-Core Microcontroller XL Series 236 Pin 236-LFBGA

SOT-23

XL210-256-FB236-I20 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 236-LFBGA
Number of Pins 236
Supplier Device Package 236-FBGA (10x10)
Operating Temperature -40°C~85°C TA
Packaging Tray
Series XL
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Oscillator Type External
Number of I/O 128
Speed 2000MIPS
RAM Size 256K x 8
Memory Type ROMless
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory Type ROMless
Core Size 32-Bit 10-Core
Core Architecture XCore
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
168 $10.67601 $1793.56968
XL210-256-FB236-I20 Product Details

XL210-256-FB236-I20 Overview


In a 236-LFBGA package, the MCU is available. 128 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 32-Bit 10-Core core is the core of the MCU. There is a ROMless type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. XL series components make up this electrical component. A XCore Core processor is used to power the device. Located on the chip are 236 pins. It has built-in ROMless memory. There is an integrated XCore core architecture in it.

XL210-256-FB236-I20 Features


236-LFBGA package
Mounting type of Surface Mount
Minimum temperature of -40°C


XL210-256-FB236-I20 Applications


There are a lot of XMOS
XL210-256-FB236-I20 Microcontroller applications.


  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products

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