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HNC2-2.5P-10DS(55)

HNC2-2.5P-10DS(55)

HNC2-2.5P-10DS(55)

Hirose Electric Co Ltd

HNC Series 1-Row Header Solder Brass Bulk Through Hole Tin Polyamide (PA), Nylon 10-Position Board to Board or Cable 0.256 6.50mm Height

SOT-23

HNC2-2.5P-10DS(55) Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Brass
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Polyamide (PA), Nylon
Housing Material Polyamide
Operating Temperature -55°C~85°C
Packaging Bulk
Series HNC
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 10
Number of Rows 1
Voltage - Rated 250V
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Insulation Height 0.256 6.50mm
Style Board to Board or Cable
Number of Positions Loaded All
Reach Compliance Code unknown
Current Rating 3A
Pitch - Mating 0.098 2.50mm
Insulation Color Black
Contact Length - Post 0.118 3.00mm
Shrouding Unshrouded
Contact Length - Mating 0.197 5.00mm
Contact Gender Male
Overall Contact Length 0.433 11.00mm
Insulation Resistance 1GOhm
Contact Finish Thickness - Mating 39.4μin 1.00μm
Stack Height (Mating) 15.5mm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-2
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.616000 $0.616
10 $0.581132 $5.81132
100 $0.548238 $54.8238
500 $0.517205 $258.6025
1000 $0.487930 $487.93
HNC2-2.5P-10DS(55) Product Details

HNC2-2.5P-10DS(55) Overview


Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the HNC Series.There is a mounting hole at Through Hole.Devices operate at -55°C~85°C operating temperatures.

HNC2-2.5P-10DS(55) Features


HNC series


HNC2-2.5P-10DS(55) Applications


There are a lot of Hirose Electric Co Ltd
HNC2-2.5P-10DS(55) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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