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AUIRFS4310

AUIRFS4310

AUIRFS4310

Infineon Technologies

AUIRFS4310 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

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AUIRFS4310 Datasheet

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Specifications
Name Value
Type Parameter
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins 3
Transistor Element Material SILICON
Operating Temperature -55°C~175°C TJ
Packaging Tube
Published 2010
Series HEXFET®
JESD-609 Code e3
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Additional Feature AVALANCHE RATED, ULTRA-LOW RESISTANCE, HIGH RELIABILITY
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PSSO-G2
Number of Elements 1
Power Dissipation-Max 300W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 300W
Case Connection DRAIN
Turn On Delay Time 26 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 7m Ω @ 75A, 10V
Vgs(th) (Max) @ Id 4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 7670pF @ 50V
Current - Continuous Drain (Id) @ 25°C 75A Tc
Gate Charge (Qg) (Max) @ Vgs 250nC @ 10V
Rise Time 110ns
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
Fall Time (Typ) 78 ns
Turn-Off Delay Time 68 ns
Continuous Drain Current (ID) 130A
Threshold Voltage 2V
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 75A
Drain-source On Resistance-Max 0.007Ohm
Drain to Source Breakdown Voltage 100V
Pulsed Drain Current-Max (IDM) 550A
Avalanche Energy Rating (Eas) 980 mJ
Nominal Vgs 2 V
Height 4.83mm
Length 10.67mm
Width 9.65mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
AUIRFS4310 Product Details

AUIRFS4310 Description


AUIRFS4310 is a type of HEXFET? power MOSFET developed by Infineon Technologies for low on-resistance per silicon area. It is designed utilizing advanced planar technology. High flexibility and reliability can be ensured based on its fast switching speed, ruggedized device design, and logic-level gate drive. All these features enable power MOSFET AUIRFS4310 to be well suited for automotive and other applications.



AUIRFS4310 Features


  • Ruggedized device design

  • Advanced process technology

  • Ultra-low on-resistance

  • Available in the D2Pak package

  • Repetitive avalanche allowed up to Tjmax 



AUIRFS4310 Applications


  • Automotive applications


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