BGM1033N7E6327XUSA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available on our website
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BGM1033N7E6327XUSA1 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
4 Weeks
Mounting Type
Surface Mount
Package / Case
6-WDFN Exposed Pad
Surface Mount
YES
Number of Pins
7
Packaging
Tape & Reel (TR)
Published
2011
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
6
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
HTS Code
8542.39.00.01
Terminal Position
DUAL
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
2.7V
Terminal Pitch
0.54mm
Frequency
1575.42MHz
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PDSO-N6
Function
GPS Front End
Temperature Grade
INDUSTRIAL
Halogen Free
Halogen Free
Gain
14.8 dB
Telecom IC Type
TELECOM CIRCUIT
RF Type
GPS
Length
2.3mm
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$37.036480
$37.03648
10
$34.940075
$349.40075
100
$32.962335
$3296.2335
500
$31.096543
$15548.2715
1000
$29.336361
$29336.361
BGM1033N7E6327XUSA1 Product Details
BGM1033N7E6327XUSA1 Overview
As a result, RF modulator operates on the basis of frequency 1575.42MHz.RF ICs with enhanced 6-WDFN Exposed Pad packages are excellent with common characteristics.The Tape & Reel (TR) package contains this RF modulator.A Surface Mount-type PCB or development board can be used to place this RF modulator.In order to drive and receive signals from data, this RF module has 6 terminations integrated.7-pin RF module with improved power dissipation control.There must be a RF switch IC's temperature below 85°C during operation.This RF switch IC should not operate at a temperature lower than -40°C.
BGM1033N7E6327XUSA1 Features
Frequency of 1575.42MHz 6-WDFN Exposed Pad package Tape & Reel (TR) 6 terminations 7 pins
BGM1033N7E6327XUSA1 Applications
There are a lot of Infineon Technologies BGM1033N7E6327XUSA1 RF Misc ICs and Modules applications.