BSM300GB60DLCE3256HDLA1 Description

BSM300GB60DLCE3256HDLA1 developed by Infineon Technologies is a type of  IGBT module which is a modular semiconductor product which is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply and other equipment. It is characterized by energy saving, convenient installation and maintenance, and stable heat dissipation.

BSM300GB60DLCE3256HDLA1 Features

Energy saving

Convenient installation

Convenient maintenance

Stable heat dissipation

BSM300GB60DLCE3256HDLA1 Applications

Rail transit

Smart grid

Aerospace

Electric vehicles 

New energy equipment