BSM35GD120DN2 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website
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BSM35GD120DN2 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Mount
Screw
Mounting Type
Chassis Mount
Package / Case
Module
Number of Pins
17
Transistor Element Material
SILICON
Operating Temperature
150°C TJ
Published
1999
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
17
ECCN Code
EAR99
Subcategory
Insulated Gate BIP Transistors
Max Power Dissipation
280W
Terminal Position
UPPER
Terminal Form
UNSPECIFIED
Pin Count
17
Number of Elements
6
Configuration
Three Phase Inverter
Power Dissipation
280W
Case Connection
ISOLATED
Polarity/Channel Type
N-CHANNEL
Input
Standard
Collector Emitter Voltage (VCEO)
1.2kV
Max Collector Current
50A
Collector Emitter Breakdown Voltage
1.2kV
Voltage - Collector Emitter Breakdown (Max)
1200V
Collector Emitter Saturation Voltage
2.7V
Turn On Time
120 ns
Vce(on) (Max) @ Vge, Ic
3.2V @ 15V, 35A
Turn Off Time-Nom (toff)
450 ns
IGBT Type
NPT
NTC Thermistor
No
Gate-Emitter Voltage-Max
20V
Input Capacitance (Cies) @ Vce
2nF @ 25V
VCEsat-Max
3.2 V
Height
17mm
Length
107.5mm
Width
45.5mm
RoHS Status
RoHS Compliant
BSM35GD120DN2 Product Details
BSM35GD120DN2 Description
BSM35GD120DN2IGBT is the power semiconductor die, which is the abbreviation of insulated gate bipolar transistor. IGBT power module is the assembly and physical packaging of several IGBT power semiconductor chips in one package.