BSZ15DC02KDHXTMA1 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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BSZ15DC02KDHXTMA1 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerTDFN
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Published
2013
Series
Automotive, AEC-Q101, HEXFET®
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
5
ECCN Code
EAR99
Additional Feature
AVALANHE RATED
Max Power Dissipation
2.5W
Terminal Position
DUAL
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PDSO-N5
Number of Elements
2
Configuration
COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
Power - Max
2.5W
FET Type
N and P-Channel Complementary
Rds On (Max) @ Id, Vgs
55m Ω @ 5.1A, 4.5V
Vgs(th) (Max) @ Id
1.4V @ 110μA
Halogen Free
Halogen Free
Input Capacitance (Ciss) (Max) @ Vds
419pF @ 10V
Current - Continuous Drain (Id) @ 25°C
5.1A 3.2A
Gate Charge (Qg) (Max) @ Vgs
2.8nC @ 4.5V
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Continuous Drain Current (ID)
3.2A
Gate to Source Voltage (Vgs)
12V
Max Dual Supply Voltage
20V
Drain Current-Max (Abs) (ID)
5.1A
Drain-source On Resistance-Max
0.055Ohm
Pulsed Drain Current-Max (IDM)
20A
Avalanche Energy Rating (Eas)
11 mJ
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate, 2.5V Drive
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
5,000
$0.43890
$2.1945
10,000
$0.42240
$4.224
BSZ15DC02KDHXTMA1 Product Details
BSZ15DC02KDHXTMA1 Description
Innovative manufacturing techniques enable International Rectifier's Fifth Generation HEXFETs to have exceptionally low on-resistance per silicon area. This characteristic gives the design an extremely efficient and dependable device for use in a variety of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for. The SO-8 is the ideal option for a multitude of power applications thanks to its enhanced thermal characteristics and multiple-die capacity. Due to the employment of a specially designed leadframe, this change was made possible. With this invention, multiple devices can be used while substantially less board area is needed. The package is made to work with vapor phase infrared or wave soldering techniques.