DF80R07W1H5FPB11BPSA1 Description

DF80R07W1H5FPB11BPSA1 is an EasyPACK™ module with TRENCHSTOP™ 5 H5 and CoolSiC™ Schottky diode and PressFIT/pre-applied Thermal Interface Material. The DF80R07W1H5FPB11BPSA1 can be applied in Solar applications. The recommended operating temperature is between -40 to 150℃. The package of DF80R07W1H5FPB11BPSA1 is the tray.

DF80R07W1H5FPB11BPSA1 Features

CoolSiCTM Schottky diode gen 5

Increased blocking voltage capability up to 650V

Low inductive design

Low switching losses

Al2O3 substrate with low thermal resistance

Integrated NTC temperature sensor

PressFIT contact technology

Pre-applied Thermal Interface Material

DF80R07W1H5FPB11BPSA1 Applications

Solar applications

Automotive 

Body electronics & lighting 

Communications equipment 

Datacom module 

Industrial 

Power delivery