FF400R07A01E3S6XKSA2 Description

A extremely small half-bridge module aimed at hybrid and electric cars is called the Hybrid PACKTM DSC S1. The module is based on Infineon's extensive experience creating Trench-Field-Stop IGBTs and IGBT power modules, which include matching diodes with improved softness. IGBT condition can also be precisely monitored thanks to embedded temperature and current sensors on the chip. These qualities make it possible for the system to be intelligently controlled and protected.

FF400R07A01E3S6XKSA2 Features

• Blocking voltage capability increased to 700V

• Built-in Current Sensor

• Temperature sensor built-in

• Reduced Inductive Design

FF400R07A01E3S6XKSA2 Applications

• Vehicle Applications

• Electric hybrid vehicles (H)