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IRF6644TR1PBF

IRF6644TR1PBF

IRF6644TR1PBF

Infineon Technologies

IRF6644TR1PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRF6644TR1PBF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DirectFET™ Isometric MN
Number of Pins 5
Transistor Element Material SILICON
Operating Temperature -40°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2005
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
Termination SMD/SMT
Resistance 13MOhm
Additional Feature LOW CONDUCTION LOSS
Voltage - Rated DC 100V
Technology MOSFET (Metal Oxide)
Terminal Position BOTTOM
Current Rating 10.3A
JESD-30 Code R-XBCC-N3
Number of Elements 1
Power Dissipation-Max 2.8W Ta 89W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.8W
Case Connection DRAIN
Turn On Delay Time 17 ns
FET Type N-Channel
Rds On (Max) @ Id, Vgs 13m Ω @ 10.3A, 10V
Vgs(th) (Max) @ Id 4.8V @ 150μA
Input Capacitance (Ciss) (Max) @ Vds 2210pF @ 25V
Current - Continuous Drain (Id) @ 25°C 10.3A Ta 60A Tc
Gate Charge (Qg) (Max) @ Vgs 47nC @ 10V
Rise Time 26ns
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
Fall Time (Typ) 16 ns
Turn-Off Delay Time 34 ns
Continuous Drain Current (ID) 8.3A
Threshold Voltage 2.8V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 100V
Pulsed Drain Current-Max (IDM) 228A
Dual Supply Voltage 100V
Avalanche Energy Rating (Eas) 86 mJ
Recovery Time 63 ns
Nominal Vgs 2.8 V
Height 506μm
Length 6.35mm
Width 5.05mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.821816 $0.821816
10 $0.775298 $7.75298
100 $0.731414 $73.1414
500 $0.690013 $345.0065
1000 $0.650955 $650.955
IRF6644TR1PBF Product Details

IRF6644TR1PBF Description

The IRF6644PbF combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET? packaging to achieve the lowest on-state resistance in a package that has a footprint of a SO-8 and only 0.7 mm profile. The DirectFET? package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET? package allows dual sided cooling to maximize thermal transfer in power systems improving previous best thermal resistance by 80%.



IRF6644TR1PBF Applications

RoHS Compliant 

Lead-Free (Qualified up to 260??C Reflow)

Application Specifies MOSFETs

Ideal for High Performance Isolated Converter

Primary Switch Socket

Optimized for Synchronous Rectification

Low Conduction Losses

Low Profile (< 0.7mm)

Dual Sided Cooling Compatible

Compatible with existing Surface Mount Techniques 




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