IRF6644TR1PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRF6644TR1PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MN
Number of Pins
5
Transistor Element Material
SILICON
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2005
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Termination
SMD/SMT
Resistance
13MOhm
Additional Feature
LOW CONDUCTION LOSS
Voltage - Rated DC
100V
Technology
MOSFET (Metal Oxide)
Terminal Position
BOTTOM
Current Rating
10.3A
JESD-30 Code
R-XBCC-N3
Number of Elements
1
Power Dissipation-Max
2.8W Ta 89W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2.8W
Case Connection
DRAIN
Turn On Delay Time
17 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
13m Ω @ 10.3A, 10V
Vgs(th) (Max) @ Id
4.8V @ 150μA
Input Capacitance (Ciss) (Max) @ Vds
2210pF @ 25V
Current - Continuous Drain (Id) @ 25°C
10.3A Ta 60A Tc
Gate Charge (Qg) (Max) @ Vgs
47nC @ 10V
Rise Time
26ns
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
16 ns
Turn-Off Delay Time
34 ns
Continuous Drain Current (ID)
8.3A
Threshold Voltage
2.8V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
100V
Pulsed Drain Current-Max (IDM)
228A
Dual Supply Voltage
100V
Avalanche Energy Rating (Eas)
86 mJ
Recovery Time
63 ns
Nominal Vgs
2.8 V
Height
506μm
Length
6.35mm
Width
5.05mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.821816
$0.821816
10
$0.775298
$7.75298
100
$0.731414
$73.1414
500
$0.690013
$345.0065
1000
$0.650955
$650.955
IRF6644TR1PBF Product Details
IRF6644TR1PBF Description
The IRF6644PbF combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET? packaging to achieve the lowest on-state resistance in a package that has a footprint of a SO-8 and only 0.7 mm profile. The DirectFET? package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET? package allows dual sided cooling to maximize thermal transfer in power systems improving previous best thermal resistance by 80%.