IRF6811STRPBF Description

The IRF6811STRPbF combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET? packaging to achieve improved performance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET? package is compatible with

existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET? package allows

dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

IRF6811STRPBF Features

RoHS Compliant and Halogen Free

Low Profile (<0.7 mm)

Dual Sided Cooling Compatible

Ultra Low Package Inductance

Optimized for High Frequency Switching

Ideal for CPU Core DC-DC Converters

Optimized for Control FET Application

Compatible with existing Surface Mount Techniques

100% Rg tested

Footprint compatible to DirectFET