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IRF7317TRPBF

IRF7317TRPBF

IRF7317TRPBF

Infineon Technologies

IRF7317TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF7317TRPBF Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 1997
Series HEXFET®
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 29mOhm
Terminal Finish Matte Tin (Sn)
Additional Feature AVALANCHE RATED, ULTRA LOW RESISTANCE
Max Power Dissipation 2W
Terminal Position DUAL
Terminal Form GULL WING
Current Rating 6.6A
Base Part Number IRF7317PBF
Number of Elements 2
Operating Mode ENHANCEMENT MODE
Power Dissipation 2W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 29m Ω @ 6A, 4.5V
Vgs(th) (Max) @ Id 700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 900pF @ 15V
Current - Continuous Drain (Id) @ 25°C 6.6A 5.3A
Gate Charge (Qg) (Max) @ Vgs 27nC @ 4.5V
Rise Time 40ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 49 ns
Turn-Off Delay Time 42 ns
Continuous Drain Current (ID) 6.6A
Threshold Voltage 700mV
Gate to Source Voltage (Vgs) 12V
Drain to Source Breakdown Voltage 20V
Avalanche Energy Rating (Eas) 100 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 700 mV
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
4,000 $0.48125 $1.925
8,000 $0.45719 $3.65752
12,000 $0.44000 $5.28
IRF7317TRPBF Product Details

IRF7317TRPBF    Description


The fifth generation HEXFET of the International Rectifier Company adopts advanced technology to achieve a very low switching quantity per unit area. This benefit. Combined with the fast switching speed and rugged device design of HExFET Power MOSFET, HExFET Power MOSFET provides designers with an extremely reliable device that can be used in a variety of applications.

SO-8 has been improved by customizing lead frames to enhance thermal and multi-chip capabilities, making it ideal for power applications. With these improvements, a variety of devices can be used in applications that significantly reduce circuit board space. The package is designed for vapor phase interior or wave soldering technology.

 

IRF7317TRPBF    Features


Generation V Technology

Ultra Low On-Resistance

Dual N and P Channel MOSFET

Surface Mount

Fully Avalanche Rated

Lead-Free

 

IRF7317TRPBF    Applications


HExFET Power MOSFET provides designers with an extremely reliable device that can be used in a variety of applications.

 

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