IRF7317TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF7317TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1997
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
29mOhm
Terminal Finish
Matte Tin (Sn)
Additional Feature
AVALANCHE RATED, ULTRA LOW RESISTANCE
Max Power Dissipation
2W
Terminal Position
DUAL
Terminal Form
GULL WING
Current Rating
6.6A
Base Part Number
IRF7317PBF
Number of Elements
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
29m Ω @ 6A, 4.5V
Vgs(th) (Max) @ Id
700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
900pF @ 15V
Current - Continuous Drain (Id) @ 25°C
6.6A 5.3A
Gate Charge (Qg) (Max) @ Vgs
27nC @ 4.5V
Rise Time
40ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
49 ns
Turn-Off Delay Time
42 ns
Continuous Drain Current (ID)
6.6A
Threshold Voltage
700mV
Gate to Source Voltage (Vgs)
12V
Drain to Source Breakdown Voltage
20V
Avalanche Energy Rating (Eas)
100 mJ
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Nominal Vgs
700 mV
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
IRF7317TRPBF Product Details
IRF7317TRPBF Description
The fifth generation HEXFET of the International Rectifier Company adopts advanced technology to achieve a very low switching quantity per unit area. This benefit. Combined with the fast switching speed and rugged device design of HExFET Power MOSFET, HExFET Power MOSFET provides designers with an extremely reliable device that can be used in a variety of applications.
SO-8 has been improved by customizing lead frames to enhance thermal and multi-chip capabilities, making it ideal for power applications. With these improvements, a variety of devices can be used in applications that significantly reduce circuit board space. The package is designed for vapor phase interior or wave soldering technology.
IRF7317TRPBF Features
Generation VTechnology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Surface Mount
Fully Avalanche Rated
Lead-Free
IRF7317TRPBF Applications
HExFET Power MOSFET provides designers with an extremely reliable device that can be used in a variety of applications.