IRF7389TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF7389TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2004
Series
HEXFET®
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
29mOhm
Additional Feature
AVALANCHE RATED, ULTRA LOW RESISTANCE
Max Power Dissipation
2.5W
Terminal Position
DUAL
Terminal Form
GULL WING
Current Rating
7.3A
Base Part Number
IRF7389PBF
Number of Elements
2
Row Spacing
6.3 mm
Number of Channels
1
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2.5W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
29m Ω @ 5.8A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
650pF @ 25V
Gate Charge (Qg) (Max) @ Vgs
33nC @ 10V
Rise Time
13ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
32 ns
Turn-Off Delay Time
34 ns
Continuous Drain Current (ID)
7.3A
Threshold Voltage
1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
30V
Pulsed Drain Current-Max (IDM)
30A
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Nominal Vgs
1 V
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.23000
$1.23
500
$1.2177
$608.85
1000
$1.2054
$1205.4
1500
$1.1931
$1789.65
2000
$1.1808
$2361.6
2500
$1.1685
$2921.25
IRF7389TRPBF Product Details
IRF7389TRPBF Description
In order to produce extraordinarily low on-resistance per silicon area, International Rectifier's Fifth Generation HEXFETs employ cutting-edge processing processes. With this benefit combined with the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are renowned for, the designe is given an incredibly efficient and dependable device for usage in a number of applications. Its improved thermal properties and multiple-die capacity make the SO-8 perfect for a variety of power applications. This modification was made possible by a specially designed leadframe. This advancement allows for the usage of many devices while drastically reducing the amount of board space needed. Vapor phase infrared, or wave soldering technology is intended for use with the packaging.