IRF7450 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRF7450 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2001
Series
HEXFET®
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
TIN LEAD
Additional Feature
AVALANCHE RATED
HTS Code
8541.29.00.95
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
245
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G8
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
2.5W Ta
Operating Mode
ENHANCEMENT MODE
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
170m Ω @ 1.5A, 10V
Vgs(th) (Max) @ Id
5.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
940pF @ 25V
Current - Continuous Drain (Id) @ 25°C
2.5A Ta
Gate Charge (Qg) (Max) @ Vgs
39nC @ 10V
Drain to Source Voltage (Vdss)
200V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±30V
JEDEC-95 Code
MS-012AA
Drain Current-Max (Abs) (ID)
2.5A
Drain-source On Resistance-Max
0.17Ohm
Pulsed Drain Current-Max (IDM)
20A
DS Breakdown Voltage-Min
200V
Avalanche Energy Rating (Eas)
230 mJ
RoHS Status
Non-RoHS Compliant
IRF7450 Product Details
IRF7450 Description
The exceptionally low on-resistance per silicon area is made possible by the use of cutting-edge manufacturing processes in these P-Channel HEXFET? Power MOSFETs from International Rectifier. This advantage gives the designer access to a highly effective tool for use in load and battery management applications.
The SO-8 is excellent for a range of power applications because to modifications made to its leadframe, including improved thermal performance and multiple-die support. These upgrades allow for the usage of many devices while drastically reducing board space in an application. The package is made to work with wave, infrared, or vapor phase soldering processes.