IRF7726 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRF7726 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2000
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Additional Feature
ULTRA LOW RESISTANCE
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PDSO-G8
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
1.79W Ta
Operating Mode
ENHANCEMENT MODE
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
26m Ω @ 7A, 10V
Vgs(th) (Max) @ Id
2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
2204pF @ 25V
Current - Continuous Drain (Id) @ 25°C
7A Ta
Gate Charge (Qg) (Max) @ Vgs
69nC @ 10V
Drain to Source Voltage (Vdss)
30V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±20V
Drain Current-Max (Abs) (ID)
7A
Drain-source On Resistance-Max
0.026Ohm
Pulsed Drain Current-Max (IDM)
28A
DS Breakdown Voltage-Min
30V
RoHS Status
Non-RoHS Compliant
IRF7726 Product Details
IRF7726 Description
International Rectifier's HEXFET? Power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This benefit, along with the ruggedized device design for which International Rectifier is renowned, gives the designer access to a very effective and dependable tool for managing load and batteries.
The smallest footprint in an SOIC outline is offered by the new Micro8 package, which has a footprint area that is half that of the conventional SO-8. Because of this, the Micro8 is a great option for situations where printed circuit board space is limited. The Micro8 will be able to readily fit into extremely thin application contexts like portable electronics and PCMCIA cards thanks to its low profile (1.2mm).