IRFP2907PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRFP2907PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
TO-247-3
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tube
Published
2004
Series
HEXFET®
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Termination
Through Hole
ECCN Code
EAR99
Resistance
4.5MOhm
Additional Feature
AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
Voltage - Rated DC
75V
Technology
MOSFET (Metal Oxide)
Current Rating
209A
Number of Elements
1
Number of Channels
1
Power Dissipation-Max
470W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
470W
Case Connection
DRAIN
Turn On Delay Time
23 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
4.5m Ω @ 125A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
13000pF @ 25V
Current - Continuous Drain (Id) @ 25°C
209A Tc
Gate Charge (Qg) (Max) @ Vgs
620nC @ 10V
Rise Time
190ns
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
130 ns
Turn-Off Delay Time
130 ns
Continuous Drain Current (ID)
209A
Threshold Voltage
4V
JEDEC-95 Code
TO-247AC
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
90A
Drain to Source Breakdown Voltage
75V
Pulsed Drain Current-Max (IDM)
840A
Dual Supply Voltage
75V
Recovery Time
210 ns
Max Junction Temperature (Tj)
175°C
Nominal Vgs
4 V
Height
24.99mm
Length
15.87mm
Width
5.3086mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$6.84000
$6.84
10
$6.14800
$61.48
400
$4.65315
$1861.26
800
$3.84800
$3078.4
IRFP2907PBF Product Details
IRFP2907PBF Description
This HEXFET power MOSFET IRFP2907PBF strip plane design uses the latest technology to achieve extremely low on-resistance per silicon area. Other features of the HEXFET power MOSFET include a 175 °C junction operating temperature, fast switching speed and an improved repeated avalanche rating. The combination of these advantages makes the design an extremely efficient and reliable device used in a variety of applications.