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IRFR2405PBF

IRFR2405PBF

IRFR2405PBF

Infineon Technologies

IRFR2405PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRFR2405PBF Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 52 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-252-3, DPak (2 Leads + Tab), SC-63
Number of Pins 3
Operating Temperature -55°C~175°C TJ
Packaging Tube
Published 2000
Series HEXFET®
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
Voltage - Rated DC 55V
Technology MOSFET (Metal Oxide)
Current Rating 56A
Number of Elements 1
Power Dissipation-Max 110W Tc
Element Configuration Single
Power Dissipation 110W
Turn On Delay Time 15 ns
FET Type N-Channel
Rds On (Max) @ Id, Vgs 16m Ω @ 34A, 10V
Vgs(th) (Max) @ Id 4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 2430pF @ 25V
Current - Continuous Drain (Id) @ 25°C 56A Tc
Gate Charge (Qg) (Max) @ Vgs 110nC @ 10V
Rise Time 130ns
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
Fall Time (Typ) 78 ns
Turn-Off Delay Time 55 ns
Continuous Drain Current (ID) 56A
Threshold Voltage 4V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 55V
Dual Supply Voltage 55V
Recovery Time 93 ns
Nominal Vgs 4 V
Height 2.3876mm
Length 6.7056mm
Width 6.22mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Contains Lead, Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.65988 $1.97964
IRFR2405PBF Product Details

IRFR2405PBF Description


International Rectifier's Seventh Generation HEXFET? Power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This feature offers the designer a highly efficient and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET power MOSFETs are widely known for.

The D-Pak is made to be surface mounted utilizing infrared, vapor phase, or wave soldering methods. For throughhole mounting applications, use the straight lead version (IRFU series). In a typical surface mount, power dissipation values of up to 1.5 watts are possible.



IRFR2405PBF Features


  • Surface Mount (IRFR2405)

  • Straight Lead (IRFU2405)

  • Advanced Process Technology

  • Dynamic dv/dt Rating

  • Fast Switching

  • Fully Avalanche Rated

  • Lead-Free



IRFR2405PBF Applications


  • Power Management

  • Consumer Electronics

  • Portable Devices

  • Industrial


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