IRFR2405PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRFR2405PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
52 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Number of Pins
3
Operating Temperature
-55°C~175°C TJ
Packaging
Tube
Published
2000
Series
HEXFET®
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
SMD/SMT
ECCN Code
EAR99
Voltage - Rated DC
55V
Technology
MOSFET (Metal Oxide)
Current Rating
56A
Number of Elements
1
Power Dissipation-Max
110W Tc
Element Configuration
Single
Power Dissipation
110W
Turn On Delay Time
15 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
16m Ω @ 34A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
2430pF @ 25V
Current - Continuous Drain (Id) @ 25°C
56A Tc
Gate Charge (Qg) (Max) @ Vgs
110nC @ 10V
Rise Time
130ns
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
78 ns
Turn-Off Delay Time
55 ns
Continuous Drain Current (ID)
56A
Threshold Voltage
4V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
55V
Dual Supply Voltage
55V
Recovery Time
93 ns
Nominal Vgs
4 V
Height
2.3876mm
Length
6.7056mm
Width
6.22mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
IRFR2405PBF Product Details
IRFR2405PBF Description
International Rectifier's Seventh Generation HEXFET? Power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This feature offers the designer a highly efficient and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET power MOSFETs are widely known for.
The D-Pak is made to be surface mounted utilizing infrared, vapor phase, or wave soldering methods. For throughhole mounting applications, use the straight lead version (IRFU series). In a typical surface mount, power dissipation values of up to 1.5 watts are possible.