IRLL024ZTRPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRLL024ZTRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-261-4, TO-261AA
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2004
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
4
ECCN Code
EAR99
Resistance
60MOhm
Terminal Finish
Matte Tin (Sn)
Additional Feature
HIGH RELIABILITY
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G4
Number of Elements
1
Power Dissipation-Max
1W Ta
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2.8W
Case Connection
DRAIN
Turn On Delay Time
8.6 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
60m Ω @ 3A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
380pF @ 25V
Current - Continuous Drain (Id) @ 25°C
5A Tc
Gate Charge (Qg) (Max) @ Vgs
11nC @ 5V
Rise Time
33ns
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±16V
Fall Time (Typ)
15 ns
Turn-Off Delay Time
20 ns
Continuous Drain Current (ID)
5A
Gate to Source Voltage (Vgs)
16V
Drain Current-Max (Abs) (ID)
5A
Drain to Source Breakdown Voltage
55V
Pulsed Drain Current-Max (IDM)
40A
Height
1.4478mm
Length
6.6802mm
Width
3.7mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.96000
$0.96
500
$0.9504
$475.2
1000
$0.9408
$940.8
1500
$0.9312
$1396.8
2000
$0.9216
$1843.2
2500
$0.912
$2280
IRLL024ZTRPBF Product Details
IRLL024ZTRPBF Description
IRLL024ZTRPBF, manufactured by Infineon Technologies. It's category belong to Electronic Components ICs. To achieve exceptionally low on-resistance per silicon area, the IRLL024ZTRPBF HEXFET? Power MOSFET employs the most advanced processing techniques. A 150°C junction operating temperature, quick switching speed, and increased repeating avalanche rating are all included in this design. These characteristics combine to make this design a highly efficient and dependable device that may be used in a wide range of applications.