IRLR8103 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRLR8103 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Surface Mount
YES
Transistor Element Material
SILICON
Packaging
Tube
Series
HEXFET®
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Technology
MOSFET (Metal Oxide)
Terminal Position
SINGLE
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PSSO-G2
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
89W Ta
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
7m Ω @ 15A, 10V
Vgs(th) (Max) @ Id
2V @ 250μA (Min)
Current - Continuous Drain (Id) @ 25°C
89A Ta
Gate Charge (Qg) (Max) @ Vgs
50nC @ 5V
Drain to Source Voltage (Vdss)
30V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±20V
JEDEC-95 Code
TO-252AA
Drain Current-Max (Abs) (ID)
89A
Drain-source On Resistance-Max
0.0085Ohm
Pulsed Drain Current-Max (IDM)
350A
DS Breakdown Voltage-Min
30V
RoHS Status
Non-RoHS Compliant
IRLR8103 Product Details
IRLR8103 Description
A previously unheard-of balance between on-resistance and gate charge is achieved by the IRLR8103's use of cutting-edge HEXFET? power MOSFET technology. They are perfect for high efficiency DC-DC converters that power the newest generation of microprocessors due to the decreased conduction and switching losses. The RDS(on), gate charge, and Cdv/dt-induced turn-on immunity parameters that are crucial in synchronous buck converters have all been optimized and rigorously tested for in both the IRLR8103 and IRLR8503. For synchronous FET applications, the IRLR8103 offers particularly low RDS(on) and strong Cdv/dt immunity. For decreased losses in control FET applications, the IRLR8503 provides an incredibly low combination of Qsw & RDS(on). The package is made for wave, convection, vapor phase, and infrared soldering processes. In a typical PCB mount application, power dissipation of more than 80W is achievable.
IRLR8103 Features
Low Switching Losses
Low Conduction Losses
Ideal for CPU Core DC-DC Converters
N-Channel Application-Specific MOSFETs
Minimizes Parallel MOSFETs for high current applications