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KVR16LE11L/8

KVR16LE11L/8

KVR16LE11L/8

Kingston Technology

KVR16LE11L/8 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

KVR16LE11L/8 Datasheet

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Specifications
Name Value
Type Parameter
ECCN (US) EAR99
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 800
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks Dual
CAS Latency 11
PC Type PC3L-12800
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 18.75
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 1Gx72
PLL Yes
Self Refresh Yes
Module Type 240DIMM
RoHS Status Yes with exemptions

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