Film Over Foam 0.315 8.00mm 0.315 8.00mm 0.315 8.00mm SMD Grounding Metallized Polyurethane Foam, Tin-Copper Polyester (SN/CU) 8.001mm Hourglass -40°C~70°C
SOT-23
67SLH080080080PI00 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
3 Weeks
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape
Hourglass
Operating Temperature
-40°C~70°C
Packaging
Tape & Reel (TR)
Series
SMD Grounding Metallized
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Film Over Foam
Max Operating Temperature
158°C
Min Operating Temperature
-40°C
Attachment Method
Solder
Height
0.315 8.00mm
Length
0.315 8.00mm
Width
0.315 8.00mm
Thickness
8.001mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
500
$0.42780
$213.9
1,000
$0.34224
$0.34224
2,500
$0.31016
$0.62032
5,000
$0.28877
$1.44385
12,500
$0.27807
$3.33684
25,000
$0.26738
$6.6845
67SLH080080080PI00 Product Details
67SLH080080080PI00 Overview
Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.High reliability is achieved by using advanced RFI and EMI contact' packagings Tape & Reel (TR).Contacter RFI should run at a temperature 158°C higher than 158°C.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.
67SLH080080080PI00 Features
Film Over Foam Tape & Reel (TR) is used SMD Grounding Metallized series
67SLH080080080PI00 Applications
There are a lot of Laird Technologies EMI 67SLH080080080PI00 RFI and EMI Contacts applications.