XCVU11P-2FSGD2104I Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 572 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 2835000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a result of space limitations, this FPGA model has been included in Tray. There are 396150400 RAM bits that are available with this device. This FPGA is built as an array of 162000 LABs/CLBs.

XCVU11P-2FSGD2104I Features

572 I/Os
Up to 396150400 RAM bits

XCVU11P-2FSGD2104I Applications

There are a lot of Xilinx Inc. XCVU11P-2FSGD2104I FPGAs applications.

• Data Center
• Radar and Sensors
• Device controllers
• Medical imaging
• Automotive
• ADAS
• Secure Communication
• Industrial,Medical and Scientific Instruments
• ASIC prototyping
• Data center hardware accelerators