LFE5U-85F-8BG756C Overview

There are two packages that contain fpga chips: 756-FBGA package and X package. The device has 365 I/O ports for more coherent data transfer. Logic blocks consist of 84000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 1.045V~1.155V-volt supply voltage required for the device to operate. FPGAs belonging to the ECP5 series are a type of FPGA that belong to the ECP5 series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Having a RAM bit size of 3833856 means that this device will offer you a lot of memory. The RAM si468kBe of this FPGA module reaches 468kB so as to guarantee the normal operation of the program during operation. 21000 LABs and CLBs are built into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. As a result of the design of this module, the maximum operating temperature reaches 85°C. Operating temperatures should exceed 0°C. The basic building block of the system is composed of 21000 logic blocks (LABs). 756-CABGA (27x27) stands for its supplier device package.

LFE5U-85F-8BG756C Features

365 I/Os
Up to 3833856 RAM bits
85°C gates
21000 logic blocks (LABs)

LFE5U-85F-8BG756C Applications

There are a lot of Lattice Semiconductor Corporation LFE5U-85F-8BG756C FPGAs applications.

• OpenCL
• Telecommunication
• Space Applications
• Embedded Vision
• Artificial intelligence (AI)
• Industrial IoT
• Defense Applications
• Military DSP
• Automotive
• Wireless Communications