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MAX5936LAESA+

MAX5936LAESA+

MAX5936LAESA+

Maxim Integrated

Tube Obsolete 1 Hot Swap Controllers SOIC 1

SOT-23

MAX5936LAESA+ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 8
Packaging Tube
Published 2006
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish MATTE TIN
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Pin Count 8
Temperature Grade INDUSTRIAL
Number of Channels 1
Max Supply Voltage -80V
Min Supply Voltage -10V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Nominal Supply Current 1.4mA
Power Dissipation 471mW
Adjustable Threshold NO
Length 4.9mm
Width 3.9mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $4.12000 $4.12
10 $3.91400 $39.14
25 $2.85000 $71.25
50 $2.70760 $135.38
100 $1.91720 $191.72
MAX5936LAESA+ Product Details

MAX5936LAESA+ Overview


You get it with the SOIC package.Currently, 1 channels can be accessed.Hot-swappable device comes in the shape of a Tube.Hot-swappable device terminates wHot-swappable deviceh 8 in total.Device DUAL is in the terminal position.Total number of pins is 8.Operating the device requires 8 pins.There is a Surface Mount-axis orientation to it.Stable operation can be achieved with a maximum operating temperature of 85°C°C.Hot-swappable device operates at a minimum temperature of -40°C degrees Celsius in order to ensure reliabilHot-swappable devicey.An analog IC, POWER SUPPLY SUPPORT CIRCUIT in this instance, is used for this gadget.There is a maximum supply voltage of -80VV that it can handle.Low supply voltages, such as -10VV, are possible.

MAX5936LAESA+ Features


The terminal position of 8


MAX5936LAESA+ Applications


There are a lot of Maxim Integrated
MAX5936LAESA+ hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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