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XRT86VX38IB329ES

XRT86VX38IB329ES

XRT86VX38IB329ES

MaxLinear, Inc.

Telecom device8 Circuits

SOT-23

XRT86VX38IB329ES Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-FBGA
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -40°C~85°C
Packaging Bulk
Part Status Active
Voltage - Supply 3.3V
Function Line Interface Unit (LIU)
Number of Circuits 8
RoHS Status RoHS Compliant
XRT86VX38IB329ES Product Details

XRT86VX38IB329ES Overview


In order to save space on the board, 256-FBGA packages are used.Telecommunications equipment is packed using the Bulk method.A Surface Mount-mount is used for mounting the telecom circuit.An 8-circuit makes up this telecom IC .The supply voltage of 3.3V can increase efficiency.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.

XRT86VX38IB329ES Features


Available in the 256-FBGA package

XRT86VX38IB329ES Applications


There are a lot of MaxLinear, Inc. XRT86VX38IB329ES Telecom applications.

  • Private branch exchange (PBX)
  • DECT (Digital European Cordless Telephone) Base
  • Digital Cross-connect Systems (DCS)
  • PCM channel bank
  • Cable Telephony
  • Digital Access Cross-connect System (DACs)
  • E2 Rates PCM Line Interface
  • Hybrid fiber coax (HFC)
  • NIU
  • Interfaces to E3

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