This SoC is built on ARM® Cortex®-M3 core processor(s).

A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 484-BGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 233.There is a flash of 256KB.Searching M2S010TS will yield system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.In order for the SoC computing to start up, -40°C is sufficient.There is a design maximum operating temperature of 100°C for this SoC system on chip.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S010TS-1FG484I System On Chip (SoC) applications.

• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances
• Industrial automation devices
• Sports