-40°C~100°C TJ M2S150 System On Chip SmartFusion®2 Series 574 I/O 1.2V
SOT-23
M2S150-1FC1152I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time
12 Weeks
Package / Case
1152-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2009
JESD-609 Code
e0
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Frequency
166MHz
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
M2S150
JESD-30 Code
S-PBGA-B1152
Number of Outputs
574
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Interface
CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O
574
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
574
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Primary Attributes
FPGA - 150K Logic Modules
Number of Logic Cells
146124
Flash Size
512KB
Length
35mm
Height Seated (Max)
2.9mm
Width
35mm
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
24
$330.66792
$7936.03008
M2S150-1FC1152I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 574 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.Power supply should be at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Using this SoC chip, you have the option of having 574 outputs.There is 1.2V power supply required for system on chip.There are 574 inputs available on the SoC chip.146124 logic cells are present in logic system on chips.The flash is set to 512KB.By searching M2S150, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150-1FC1152I System On Chip (SoC) applications.