325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
SOT-23
M2S060T-1FCSG325I Datasheet
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Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
10 Weeks
Package / Case
325-TFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
325
Terminal Finish
MATTE TIN
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B325
Number of Outputs
200
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Number of I/O
200
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
200
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 60K Logic Modules
Number of Logic Cells
56520
Flash Size
256KB
Length
11mm
Height Seated (Max)
1.01mm
Width
11mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$98.19898
$17283.02048
M2S060T-1FCSG325I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 325 terminations, which is great for system on a chip.There are 200 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 200 inputs available for use.Logic system on chips consist of 56520 logic cells.There is a flash of 256KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash. LG-MIN, WD-MIN
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