676 Terminations 0°C~85°C TJ M2S090 System On Chip SmartFusion®2 Series 425 I/O 1.2V
SOT-23
M2S090-1FGG676 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
8 Weeks
Package / Case
676-BGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2009
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
Terminal Finish
MATTE TIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
1mm
Frequency
166MHz
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
M2S090
JESD-30 Code
S-PBGA-B676
Number of Outputs
425
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Interface
CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O
425
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
425
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Primary Attributes
FPGA - 90K Logic Modules
Number of Logic Cells
86316
Flash Size
512KB
Length
27mm
Height Seated (Max)
2.44mm
Width
27mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
40
$196.84000
$7873.6
M2S090-1FGG676 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 90K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 425 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 676 terminations in total.In order for this SoC chip to work properly, you can have 425 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 425 inputs.In logic system on chips, there are 86316 logic cells.As for its flash size, it is 512KB.By searching M2S090, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 512KB extended flash. Core Architecture: ARM