U1AFS250-FGG256 Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. A total of 114 I/Os allow data to be transferred in a more coherent manner. Surface Mount-connectors can be used to attach this FPGA module to the development board. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. It is a type of FPGA belonging to the Fusion? seies. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. The RAM bits that are offered by this fpga chips are 36864. Related parts can be found by using its base part number U1AFS250. The RAM si4.5kBe of this FPGA module reaches 4.5kB so as to guarantee the normal operation of the program during operation. In this case, 256 pins are used in the design. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. When this module is operated at its maximum operating temperature, it reaches 85°C. Operating temperatures should exceed 0°C. Fpga semiconductor is made up of 250000 gates as fpga semiconductors basic building block. There is a device package provided by 256-FPBGA (17x17), which is the supplier.

U1AFS250-FGG256 Features

114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
85°C gates

U1AFS250-FGG256 Applications

There are a lot of Microsemi Corporation U1AFS250-FGG256 FPGAs applications.

• Cryptography
• Automotive Applications
• OpenCL
• Wireless Communications
• Ecosystem
• Industrial Ethernet
• Aircraft navigation
• Software-defined radio
• ASIC prototyping
• Space Applications