MPC8xx Microprocessor MPC8xx Series MPC870 256-BBGA
SOT-23
KMPC870CVR66 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
256-BBGA
Supplier Device Package
256-PBGA (23x23)
Operating Temperature
-40°C~100°C TA
Packaging
Tray
Series
MPC8xx
Published
2003
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC870
Speed
66MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10/100Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
USB
USB 2.0 (1)
Additional Interfaces
I2C, PCMCIA, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
KMPC870CVR66 Product Details
KMPC870CVR66 Overview
The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~100°C TA should be understood. This is part of the MPC8xx series. The CPU is powered by a MPC8xx core. There are DRAM RAM controllers on this CPU. This microprocessor features I2C, PCMCIA, SPI, TDM, UART interfaces to better serve its users. The CPU runs I/O at 3.3V. Using MPC870 will help you find variants of the cpu microprocessor. Suppliers offer 256-PBGA (23x23) packages.
KMPC870CVR66 Features
MPC8xx Core
KMPC870CVR66 Applications
There are a lot of NXP USA Inc. KMPC870CVR66 Microprocessor applications.