Shipping overseas is convenient since the embedded microprocessor is packed in 357-BBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU uses DRAM RAM controllers. This microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MC860 if you are looking for variants.
MC860ENCZQ50D4R2 Features
MC860ENCZQ50D4R2 Applications
There are a lot of NXP USA Inc. MC860ENCZQ50D4R2 Microprocessor applications.