BCP53 Description

The BCP53 is a SOT223 surface-mount plastic package that houses a 1A PNP Medium Power Transistor. It has a heat sink that is exposed for optimum thermal and electrical conductivity. It's built for medium-power surface-mounting applications.

BCP53 Features

• High Current: 1.5 Amps

• NPN Complement is BCP56

• Pb-Free Packages are Available

• High power dissipation capability

• The SOT‐223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die

BCP53 Applications

• Amplifiers

• MOSFET drivers

• High-side switches

• Power management

• Battery-driven devices

• Linear voltage regulators