BS108ZL1G datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
SOT-23
BS108ZL1G Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Lifecycle Status
LAST SHIPMENTS (Last Updated: 1 day ago)
Contact Plating
Copper, Silver, Tin
Mounting Type
Through Hole
Package / Case
TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Surface Mount
NO
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Box (TB)
Published
2006
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
ECCN Code
EAR99
Resistance
8Ohm
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
LOGIC LEVEL COMPATIBLE
Subcategory
FET General Purpose Power
Voltage - Rated DC
200V
Technology
MOSFET (Metal Oxide)
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Current Rating
250mA
[email protected] Reflow Temperature-Max (s)
40
Pin Count
3
Number of Elements
1
Power Dissipation-Max
350mW Ta
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
350mW
Turn On Delay Time
15 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
8 Ω @ 100mA, 2.8V
Vgs(th) (Max) @ Id
1.5V @ 1mA
Input Capacitance (Ciss) (Max) @ Vds
150pF @ 25V
Current - Continuous Drain (Id) @ 25°C
250mA Ta
Drive Voltage (Max Rds On,Min Rds On)
2V 2.8V
Vgs (Max)
±20V
Turn-Off Delay Time
15 ns
Continuous Drain Current (ID)
250mA
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
0.25A
Drain to Source Breakdown Voltage
200V
Height
5.33mm
Length
5.2mm
Width
4.19mm
Radiation Hardening
No
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.264198
$1.264198
10
$1.192640
$11.9264
100
$1.125132
$112.5132
500
$1.061445
$530.7225
1000
$1.001364
$1001.364
BS108ZL1G Product Details
BS108ZL1G Description
BS108ZL1G belongs to the family of small signal MOSFETs provided by ON Semiconductor. Its inherent current sharing capability permits easy paralleling of many devices. It is specifically designed for high-voltage, high-speed switching applications, line drivers, relay drivers, CMOS logic, microprocessor or TTL to the high-voltage interface, and high-voltage display drivers.