FDB3632_SB82115

new-10%

Manufacturer part number:FDB3632_SB82115

Manufacturer:ON Semiconductor

Description:INTEGRATED CIRCUIT

Case Package:SOT-23

Datasheet:FDB3632_SB82115 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Surface Mount
Package / Case	TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Operating Temperature	-55°C~175°C TJ
Packaging	Bulk
Series	PowerTrench®
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	Not Applicable
Technology	MOSFET (Metal Oxide)
Power Dissipation-Max	310W Tc
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	9m Ω @ 80A, 10V
Vgs(th) (Max) @ Id	4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds	6000pF @ 25V
Current - Continuous Drain (Id) @ 25°C	12A Ta 80A Tc
Gate Charge (Qg) (Max) @ Vgs	110nC @ 10V
Drain to Source Voltage (Vdss)	100V
Drive Voltage (Max Rds On,Min Rds On)	6V 10V
Vgs (Max)	±20V