FDG1024NZ datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
SOT-23
FDG1024NZ Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
6-TSSOP, SC-88, SOT-363
Number of Pins
6
Weight
28mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2007
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Subcategory
FET General Purpose Power
Max Power Dissipation
360mW
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Qualification Status
Not Qualified
Number of Elements
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
360mW
Turn On Delay Time
3.7 ns
Power - Max
300mW
FET Type
2 N-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
175m Ω @ 1.2A, 4.5V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
150pF @ 10V
Gate Charge (Qg) (Max) @ Vgs
2.6nC @ 4.5V
Rise Time
1.7ns
Drain to Source Voltage (Vdss)
20V
Fall Time (Typ)
1.5 ns
Turn-Off Delay Time
11 ns
Continuous Drain Current (ID)
1.2A
Threshold Voltage
800mV
Gate to Source Voltage (Vgs)
8V
Drain-source On Resistance-Max
0.175Ohm
Drain to Source Breakdown Voltage
20V
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Nominal Vgs
800 mV
Height
1mm
Length
2mm
Width
1.25mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3,000
$0.25490
$0.7647
6,000
$0.23845
$1.4307
15,000
$0.22201
$3.33015
30,000
$0.21050
$6.315
FDG1024NZ Product Details
FDG1024NZ Description
The dual N-channel logic level enhanced mode field effect transistor is produced by proprietary high cell density DMOS technology. This very high-density process is specially tailored to minimize on-resistance. The device is designed for low-voltage applications as a substitute for bipolar digital transistors and small-signal MOSFET. Because there is no need for bias resistors, this dual-digital FET can replace several different digital transistors with different bias resistance values.
FDG1024NZ Features
Max rDS(on) = 175 mO at VGS = 4.5 V, ID = 1.2 A
Max rDS(on) = 215 mO at VGS = 2.5 V, ID = 1.0 A
Max rDS(on) = 270 mO at VGS = 1.8 V, ID = 0.9 A
Max rDS(on) = 389 mO at VGS = 1.5 V, ID = 0.8 A
HBM ESD protection level >2 kV (Note 3)
Very low level gate drive requirements allowing operation in 1.5 V circuits (VGS(th) < 1 V)
Very small package outline SC70-6
RoHS Compliant
FDG1024NZ Applications
This product is general usage and suitable for many different applications.