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FDG1024NZ

FDG1024NZ

FDG1024NZ

ON Semiconductor

FDG1024NZ datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDG1024NZ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Number of Pins 6
Weight 28mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2007
Series PowerTrench®
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Subcategory FET General Purpose Power
Max Power Dissipation 360mW
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 360mW
Turn On Delay Time 3.7 ns
Power - Max 300mW
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 175m Ω @ 1.2A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 150pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 2.6nC @ 4.5V
Rise Time 1.7ns
Drain to Source Voltage (Vdss) 20V
Fall Time (Typ) 1.5 ns
Turn-Off Delay Time 11 ns
Continuous Drain Current (ID) 1.2A
Threshold Voltage 800mV
Gate to Source Voltage (Vgs) 8V
Drain-source On Resistance-Max 0.175Ohm
Drain to Source Breakdown Voltage 20V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 800 mV
Height 1mm
Length 2mm
Width 1.25mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.25490 $0.7647
6,000 $0.23845 $1.4307
15,000 $0.22201 $3.33015
30,000 $0.21050 $6.315
FDG1024NZ Product Details

FDG1024NZ       Description


  The dual N-channel logic level enhanced mode field effect transistor is produced by proprietary high cell density DMOS technology. This very high-density process is specially tailored to minimize on-resistance. The device is designed for low-voltage applications as a substitute for bipolar digital transistors and small-signal MOSFET. Because there is no need for bias resistors, this dual-digital FET can replace several different digital transistors with different bias resistance values.


FDG1024NZ          Features

 

Max rDS(on) = 175 mO at VGS = 4.5 V, ID = 1.2 A

Max rDS(on) = 215 mO at VGS = 2.5 V, ID = 1.0 A

Max rDS(on) = 270 mO at VGS = 1.8 V, ID = 0.9 A

Max rDS(on) = 389 mO at VGS = 1.5 V, ID = 0.8 A

HBM ESD protection level >2 kV (Note 3)

Very low level gate drive requirements allowing operation in 1.5 V circuits (VGS(th) < 1 V)

Very small package outline SC70-6

RoHS Compliant


FDG1024NZ           Applications


This product is general usage and suitable for many different applications.

 


 





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