FDG330P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
SOT-23
FDG330P Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
48 Weeks
Lifecycle Status
LAST SHIPMENTS (Last Updated: 2 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
6-TSSOP, SC-88, SOT-363
Number of Pins
6
Weight
28mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2001
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Terminal Finish
Tin (Sn)
Subcategory
Other Transistors
Voltage - Rated DC
-12V
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Current Rating
-2A
Number of Elements
1
Power Dissipation-Max
750mW Ta
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
750mW
Turn On Delay Time
10 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
110m Ω @ 2A, 4.5V
Vgs(th) (Max) @ Id
1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
477pF @ 6V
Current - Continuous Drain (Id) @ 25°C
2A Ta
Gate Charge (Qg) (Max) @ Vgs
7nC @ 4.5V
Rise Time
11ns
Drain to Source Voltage (Vdss)
12V
Drive Voltage (Max Rds On,Min Rds On)
1.8V 4.5V
Vgs (Max)
±8V
Fall Time (Typ)
11 ns
Turn-Off Delay Time
12 ns
Continuous Drain Current (ID)
2A
Threshold Voltage
-700mV
Gate to Source Voltage (Vgs)
8V
Drain Current-Max (Abs) (ID)
2A
Drain to Source Breakdown Voltage
-12V
Height
1mm
Length
2mm
Width
1.25mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.34000
$0.34
500
$0.3366
$168.3
1000
$0.3332
$333.2
1500
$0.3298
$494.7
2000
$0.3264
$652.8
2500
$0.323
$807.5
FDG330P Product Details
FDG330P Description
Fairchild's innovative low voltage PowerTrench technology is used in this P-Channel 1.8V specified MOSFET. It's been designed with battery power management in mind. Lowering conduction loss, improving switching performance, increasing dv/dt rate, and increasing avalanche energy are all goals of this technology.
FDG330P Features
Rqs(on)= 110 m£2 @ Vgs = -4.5 V
@ Vqs = —2.5 V, Rds(on)= 150
@ Vgs = —1 -8 V, Rds(on)= 215 mQ
Low entry fee
Extremely low Rqsioni with high-performance trench technology
SC70-6 surface mount package is a compact industry standard.