FDG6320C datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
SOT-23
FDG6320C Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
6-TSSOP, SC-88, SOT-363
Number of Pins
6
Weight
28mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2017
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
Termination
SMD/SMT
ECCN Code
EAR99
Resistance
4Ohm
Additional Feature
LOGIC LEVEL COMPATIBLE
Subcategory
Other Transistors
Max Power Dissipation
300mW
Terminal Form
GULL WING
Current Rating
220mA
Number of Elements
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
300mW
Turn On Delay Time
5 ns
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
4 Ω @ 220mA, 4.5V
Vgs(th) (Max) @ Id
1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
9.5pF @ 10V
Current - Continuous Drain (Id) @ 25°C
220mA 140mA
Gate Charge (Qg) (Max) @ Vgs
0.4nC @ 4.5V
Rise Time
8ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
8 ns
Turn-Off Delay Time
9 ns
Continuous Drain Current (ID)
220mA
Threshold Voltage
850mV
Gate to Source Voltage (Vgs)
8V
Drain to Source Breakdown Voltage
25V
Dual Supply Voltage
25V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Height
1.1mm
Length
2mm
Width
1.25mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$41.878000
$41.878
10
$39.507547
$395.07547
100
$37.271271
$3727.1271
500
$35.161576
$17580.788
1000
$33.171298
$33171.298
FDG6320C Product Details
FDG6320C Description
These dual N & P-Channel logic level enhancement mode field effect transistors are produced using a proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for bipolar digital transistors and small signal MOSFETS. Since bias resistors are not required, this dual digital FET can replace several different digital transistors, with different bias resistor values.
FDG6320C Features
N-Ch 0.22 A, 25 V,
RDS(ON) = 4.0 |? @ VGS= 4.5 V,
RDS(ON) = 5.0 |? @ VGS= 2.7 V.
P-Ch -0.14 A, -25 V,
RDS(ON) = 10 |? @ VGS= -4.5 V,
RDS(ON) = 13 |? @ VGS= -2.7 V.
Very small package outline SC70-6.
Very low level gate drive requirements allowing direct operation in 3 V circuits (VGS(th) < 1.5 V).
Gate-Source Zener for ESD ruggedness (>6kV Human Body Model).
FDG6320C Applications
This product is general usage and suitable for many different applications.