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FDG6321C

FDG6321C

FDG6321C

ON Semiconductor

FDG6321C datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDG6321C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Number of Pins 6
Weight 28mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2017
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Resistance 450mOhm
Additional Feature LOGIC LEVEL COMPATIBLE
Subcategory Other Transistors
Max Power Dissipation 300mW
Terminal Form GULL WING
Current Rating 500mA
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 300mW
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 450m Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 50pF @ 10V
Current - Continuous Drain (Id) @ 25°C 500mA 410mA
Gate Charge (Qg) (Max) @ Vgs 2.3nC @ 4.5V
Rise Time 8ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 8 ns
Turn-Off Delay Time 55 ns
Continuous Drain Current (ID) 500mA
Threshold Voltage 800mV
Gate to Source Voltage (Vgs) 8V
Drain Current-Max (Abs) (ID) 0.5A
Drain to Source Breakdown Voltage 25V
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Logic Level Gate
Height 1.1mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.15065 $0.45195
6,000 $0.14152 $0.84912
15,000 $0.13239 $1.98585
30,000 $0.12143 $3.6429
75,000 $0.11686 $8.7645
FDG6321C Product Details

FDG6321C Description


On Semiconductor's patented, high cell density DMOS technology is used to create these dual N & P-Channel logic level enhancement mode field effect transistors. Onstate resistance is specifically reduced by this very high density method. This device was created specifically as a low voltage substitute for small signal MOSFETS and bipolar digital transistors. This dual digital FET can replace numerous distinct digital transistors with various bias resistor values because bias resistors are not necessary.



FDG6321C Features


  • SC70-very 6's compact packaging shape.

  • low-level gate drive specifications that permit direct

  • VGS(th) 1.5 V operating in 3 V circuits.

  • For ESD robustness (>6kV human body model), use a gate-source zener.



FDG6321C Applications


Switching applications


Related Part Number

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