FDMC86139P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
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FDMC86139P Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Lifecycle Status
ACTIVE (Last Updated: 14 hours ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerWDFN
Number of Pins
8
Weight
165.33333mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2017
Series
PowerTrench®
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
5
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
JESD-30 Code
S-PDSO-N5
Number of Elements
1
Number of Channels
1
Power Dissipation-Max
2.3W Ta 40W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
40W
Case Connection
DRAIN
Turn On Delay Time
11 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
67m Ω @ 4.4A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1335pF @ 50V
Current - Continuous Drain (Id) @ 25°C
4.4A Ta 15A Tc
Gate Charge (Qg) (Max) @ Vgs
22nC @ 10V
Rise Time
2.5ns
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
6V 10V
Vgs (Max)
±25V
Fall Time (Typ)
4 ns
Turn-Off Delay Time
17 ns
Continuous Drain Current (ID)
-4.4A
Threshold Voltage
-3V
Gate to Source Voltage (Vgs)
25V
Drain-source On Resistance-Max
0.067Ohm
Drain to Source Breakdown Voltage
-100V
Pulsed Drain Current-Max (IDM)
30A
Max Junction Temperature (Tj)
150°C
Turn Off Time-Max (toff)
40ns
Turn On Time-Max (ton)
30ns
Height
800μm
Length
3.3mm
Width
3.3mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
FDMC86139P Product Details
FDMC86139P Description
The FDMC86139P P-Channel MOSFET is produced using On Semiconductor's advanced PowerTrench technology. This very high density process is especially tailored to minimize on-state resistance and optimized for superior switching performance.
FDMC86139P Features
Very low RDS-on mid voltage P channel silicon technology optimised for low Qg
This product is optimised for fast switching applications as well as load switch applications