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FDMS3669S

FDMS3669S

FDMS3669S

ON Semiconductor

FDMS3669S datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDMS3669S Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerTDFN
Number of Pins 8
Weight 171mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2009
Series PowerTrench®
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Terminal Finish Tin (Sn)
Subcategory FET General Purpose Power
Max Power Dissipation 2.5W
Terminal Form FLAT
JESD-30 Code R-PDSO-F6
Number of Elements 2
Operating Mode ENHANCEMENT MODE
Case Connection DRAIN SOURCE
Power - Max 1W
FET Type 2 N-Channel (Dual) Asymmetrical
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 10m Ω @ 13A, 10V
Vgs(th) (Max) @ Id 2.7V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1605pF @ 15V
Current - Continuous Drain (Id) @ 25°C 13A 18A
Gate Charge (Qg) (Max) @ Vgs 24nC @ 10V
Rise Time 3ns
Fall Time (Typ) 3 ns
Turn-Off Delay Time 24 ns
Continuous Drain Current (ID) 60A
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 13A
Drain-source On Resistance-Max 0.01Ohm
Drain to Source Breakdown Voltage 30V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Feedback Cap-Max (Crss) 55 pF
Height 1.1mm
Length 5mm
Width 5.9mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.41950 $1.2585
6,000 $0.39852 $2.39112
15,000 $0.38354 $5.7531
FDMS3669S Product Details

FDMS3669S Description


In a twin PQFN packaging, this device has two specialized N-Channel MOSFETs. To make synchronous buck converter placement and routing simple, the switch node has been internally connected. To offer maximum power efficiency, the control MOSFET (Q1) and synchronous SyncFETTM (Q2) have been created.



FDMS3669S Features


  • Maximum rDS(on) at VGS = 10 V, ID = 18 A is 5 m.

  • Max rDS(on) is 5.2 m at 4.5 V and 17 A.

  • Shorter rise/fall times due to low inductance packing reduce switching losses.

  • The best architecture for lower circuit inductance and less switch node ringing is made possible by MOSFET integration.

  • Conforms to RoHS



FDMS3669S Applications


  • Computing 

  • Communications

  • Point of Load for All Purposes

  • Laptop VCORE


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