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FDMS86200

FDMS86200

FDMS86200

ON Semiconductor

FDMS86200 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDMS86200 Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 18 Weeks
Lifecycle Status ACTIVE (Last Updated: 6 days ago)
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerTDFN
Number of Pins 8
Weight 68.1mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2010
Series PowerTrench®
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 5
ECCN Code EAR99
Resistance 21MOhm
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal Form FLAT
JESD-30 Code R-PDSO-F5
Number of Elements 1
Number of Channels 1
Power Dissipation-Max 2.5W Ta 104W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.5W
Case Connection DRAIN
Turn On Delay Time 13 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 18m Ω @ 9.6A, 10V
Vgs(th) (Max) @ Id 4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 2715pF @ 75V
Current - Continuous Drain (Id) @ 25°C 9.6A Ta 35A Tc
Gate Charge (Qg) (Max) @ Vgs 46nC @ 10V
Rise Time 7.9ns
Drive Voltage (Max Rds On,Min Rds On) 6V 10V
Vgs (Max) ±20V
Fall Time (Typ) 5.8 ns
Turn-Off Delay Time 27 ns
Continuous Drain Current (ID) 9.6A
Threshold Voltage 2.5V
JEDEC-95 Code MO-240AA
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 52A
Drain to Source Breakdown Voltage 150V
Avalanche Energy Rating (Eas) 220 mJ
Max Junction Temperature (Tj) 150°C
Height 1.1mm
Length 5mm
Width 6mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.99495 $2.98485
6,000 $0.95810 $5.7486
FDMS86200 Product Details

FDMS86200 Description


The N-channel MOSFET FDMS86200 is manufactured using on Semiconductor's advanced POWERTRENCH process, which uses shielded gate technology. The process has been optimized for on-state resistors, but still maintains excellent switching performance.

 


FDMS86200 Features


? Shielded Gate MOSFET Technology

? Max rDS(on) = 18 m at VGS = 10 V, ID = 9.6 A

? Max rDS(on) = 21 m at VGS = 6 V, ID = 8.8 A

? Advanced Package and Silicon combination for low rDS(on) and high

efficiency

? MSL1 robust package design

? 100% UIL tested

? RoHS Compliant


FDMS86200  Applications

? DC?DC Conversion


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