FDZ197PZ Description

The FDZ197PZ lowers both PCB space and rDS by combining an innovative 1.5 V PowerTrench? technique with a state-of-the-art "fine pitch" WLCSP packaging process (on). This sophisticated WLCSP MOSFET represents a technological breakthrough in packaging, allowing it to combine superior thermal transfer properties, ultra-low profile packing, low gate charge, and low rDS (on).

FDZ197PZ Features

• Max rDS(on) = 64 mΩ at VGS = -4.5 V, ID = -2.0 A

• Max rDS(on) = 71 mmΩ at VGS = -2.5 V, ID= -2.0 A

• Max rDS(on) = 79 mmΩ at VGS = -1.8 V, ID = -1.0 A

• Max rDS(on) = 95 mmΩ at VGS = -1.5 V, ID = -1.0 A

• Occupies only 1.5 mm2 of PCB area. Less than 50% of thearea of 2 x 2 BGA

• Ultra-thin package: less than 0.65 mm height when mountedto PCB

• HBM ESD protection level > 4.4 kV (Note 3)

• RoHS Compliant

FDZ197PZ Applications

• This product is general usage and suitable for many different applications.

• Battery Management

• Load Switch

• Battery Protection