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830-10-029-10-001101

  • 830-10-029-10-001101
  • 830-10-029-10-001101

830-10-029-10-001101

830-10-029-10-001101

Preci-Dip

830 Series 1-Row Header Solder Brass Bulk Through Hole Gold Liquid Crystal Polymer (LCP), Glass Filled 29-Position Board to Board 0.110 2.79mm Height

SOT-23

830-10-029-10-001101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Brass
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Series 830
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 29
Number of Rows 1
Voltage - Rated 150VDC
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) 3A
Insulation Height 0.110 2.79mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Contact Length - Post 0.114 2.90mm
Shrouding Unshrouded
Contact Length - Mating 0.141 3.60mm
Overall Contact Length 0.394 10.00mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
170 $3.02559 $514.3503
830-10-029-10-001101 Product Details

830-10-029-10-001101 Overview


Currently, it is packaged in Header.The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the 830 Series, it belongs to the range of products of that series.Through Hole represents the mounting point for the part.-55°C~125°C Operating Temperature is the default operating temperature for the device.

830-10-029-10-001101 Features


830 series


830-10-029-10-001101 Applications


There are a lot of Preci-Dip
830-10-029-10-001101 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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