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830-80-007-30-001101

  • 830-80-007-30-001101
  • 830-80-007-30-001101

830-80-007-30-001101

830-80-007-30-001101

Preci-Dip

830 Series 1-Row Header Solder Brass Bulk Surface Mount Tin Liquid Crystal Polymer (LCP), Glass Filled 7-Position Board to Board 0.110 2.79mm Height

SOT-23

830-80-007-30-001101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Brass
Mount Surface Mount
Mounting Type Surface Mount
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Housing Material Polymer
Operating Temperature -55°C~125°C
Packaging Bulk
Series 830
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 7
Number of Rows 1
Gender Male
Voltage - Rated 150VDC
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Total Number of Contacts 7
Orientation Straight
Insulation Height 0.110 2.79mm
Style Board to Board
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Shrouding Unshrouded
Number Of PCB Rows 2
Contact Length - Mating 0.141 3.60mm
PCB Contact Pattern STAGGERED
Rated Current (Signal) 3A
Durability 500 Cycles
Height 2.8mm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
620 $0.73974 $458.6388
830-80-007-30-001101 Product Details

830-80-007-30-001101 Overview


The product is packaged in Header.This device is mounted in the Surface Mount position.It has been determined that a Bulk case is necessary to package the product.There is a product in the 830 Series.Part Surface Mount is mounted to the part.As a result, the device runs at -55°C~125°C Operating Temperature.

830-80-007-30-001101 Features


830 series


830-80-007-30-001101 Applications


There are a lot of Preci-Dip
830-80-007-30-001101 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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