DS26303LN-75+ Overview

In order to save space on the board, 144-LQFP Exposed Pad packages are used.Packing is done according to the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.8 circuits are used in this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The supply current is 250mA.

DS26303LN-75+ Features

Available in the 144-LQFP Exposed Pad package

DS26303LN-75+ Applications

There are a lot of Rochester Electronics, LLC DS26303LN-75+ Telecom applications.

• T1/E1/J1 Performance Monitoring
• ISDN NT1/TA
• Central office
• M13 MUX
• T1/E1/J1 Multiplexer and Channel Banks
• Digital loop carrier (DLC)
• E1 Network Equipment
• Fractional T1/E1/J1
• Fiber to the Home (FTTH)
• Cable modem