LFE3-70E-6FN1156I Overview

This package is included in the 1156-BBGA package and is available for purchase. A total of 490 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 67000 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 1.14V~1.26V . The FPGA belongs to the ECP3 series of FPGAs, and it is one type of FPGA. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. A device like this one offers 4526080 RAM bits, which is a considerable amount of memory. An array of 8375 LABs/CLBs is built into the FPGA. It employs 1156-FPBGA (35x35) as its supplier device package.

LFE3-70E-6FN1156I Features

490 I/Os
Up to 4526080 RAM bits

LFE3-70E-6FN1156I Applications

There are a lot of Rochester Electronics, LLC LFE3-70E-6FN1156I FPGAs applications.

• Solar Energy
• Data center search engines
• Automotive driver's assistance
• Telecommunication
• Broadcast
• Aerospace and Defense
• Automation
• Device controllers
• Consumer Electronics
• Industrial,Medical and Scientific Instruments